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The device consists of a precise, low-offset, linear Hall circuit with a copper conduction path located near the surface of the die. Applied current flowing through this copper conduction path generates a magnetic field which the Hall IC converts into a proportional voltage. Device accuracy is optimized through the close proximity of the magnetic signal to the Hall transducer. A precise, proportional voltage is provided by the low-offset, chopper-stabilized BiCMOS Hall IC, which is programmed for accuracy after packaging. The output of the device has a positive slope (>VIOUT(Q)) when an increasing current flows through the primary copper conduction path (from pins 1 and 2, to pins 3 and 4), which is the path used for current sampling. The internal resistance of this conductive path is 1.2 mΩ typical, providing low power loss.
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