The paper presents discussion related to oxygen plasma treatment, model, magnitude, microscale polishing forces , speed, structure, and microscope. In this paper you can get description such as shear forces, forces, pad, electrical interconnect, modulus, and silicon dioxide.
There are lots of explanation around rotation rate, lateral forces, calibration, hear stress sensors, finite element, and treatment are explained inside this paper. Below are chosen from the paper:
Micromachined structures with diameters ranging from 50 – 100 µm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP). The structures are 80 µm high poly-dimethyl-siloxane posts with bending stiffnesses ranging from 1.6 to 14 µN/µm. The structures were polished using a stiff, ungrooved pad and 3 wt% fumed silica slurry at relative velocities of approximately 0.5 m/s and downforces of approximately 1 psi. Observed lateral forces on the structures were on the order of 5-500 µN, and highly variable in time.
Even more, this paper explains info regarding post deflection, deflection, stiffness, polishing parameters, sensor, microscale shearing forces, and polishing forces.