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Applications of High-Performance MEMS Pressure Sensors Based on Dissolved Wafer Process Srinivas Tadigadapa and Sonbol Massoud-Ansari Integrated Sensing Systems (ISSYS) Inc., 387 Airport Industrial Drive, Ypsilanti, MI 48198 ISSYS’ exclusive dissolved wafer process (DWP) technology has enabled the development of a variety of the state-of-the-art, high performance pressure sensors for a wide range of applications. In addition to the measurement of vacuum, the differential pressure sensors along with the temperature sensors can be used for the measurement Figure 2 Sensor die containing nine pressure sensor covering a pressure measurement range from 0– 2200 Torr to 0–1 Torr.
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